Tantangan dan Solusi Perakitan BGA

BGA (Ball Grid Array) packages represent one of the most challenging aspects of modern PCB assembly. With solder balls hidden beneath the component, traditional visual inspection methods are inadequate, requiring specialized techniques and equipment. Despite these challenges, BGAs offer significant advantages including high pin density, excellent electrical performance, and superior thermal characteristics. Understanding the unique requirements of BGA assembly is essential for achieving reliable, high-quality results.

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